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学者姓名：赵玉龙
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Abstract ：
To augment the intelligence and safety of a rocket or ammunition engine start, an intelligent initiation system needs to be included in the data link. A laser-controlled intelligent initiation system with inherent safety and a laser-controlled explosion-initiating device (LCEID) incorporating electromagnetic pulse (EMP) resistant, safe-and-arms fast-acting modular device based on photovoltaic power converter technology is designed and fabricated in this work. LCEID is an integrated multi-function module consisting of the optical beam expander, GaAs photovoltaic (PV) array, safe-and-arms integrated circuit, and low-energy initiator. These components contribute to EMP resistance, fast-acting, safe-and-arm, and reliable firing, respectively. To achieve intelligent initiation, each LCEID has a unique "identification information" and a "broadcast address" embedded in integrated-circuit read-only memory (ROM), which is controlled by encoded laser addressing. The GaAs PV array was investigated to meet the low-energy initiator firing voltage requirements. Experimental results show that the open-circuit voltage, short-circuit current, and maximum power output of the four-junction GaAs PV array illuminated by a 5.5 W/cm(2) laser beam were 220 mA, 21.5 V, and 3.70 W, respectively. When the voltage of the 22 mu F energy storage capacitor exceeds 20 V, the laser charging time is found to be shorter than 2.5 s. Other aspects of LCEID, such as laser energy coupling efficiency, the firing process, and the energy-boosting mechanism, were explored. Measurements show that the coupling efficiency of the micro lens with a radius of curvature D = 20 mu m and size of r = 50 mu m reaches a maximum of 93.5%. Furthermore, for more than 18 V charge voltage, the LCEID is found to perform reliably. The fabricated LCEID demonstrated a high level of integration and intrinsic safety, as well as a finely tailored initiation performance that could be useful in military applications.
Keyword ：
explosion initiating device intelligent initiation system laser power converter safe-and-arm semiconductor bridge
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| GB/T 7714 | Yin, Guofu , Bao, Huiqin , Zhao, Yulong et al. Design, Fabrication, and Characterization of a Laser-Controlled Explosion-Initiating Device with Integrated Safe-and-Arm, EMP-Resistant, and Fast-Acting Technology Based on Photovoltaic Power Converter [J]. | MICROMACHINES , 2022 , 13 (5) . |
| MLA | Yin, Guofu et al. "Design, Fabrication, and Characterization of a Laser-Controlled Explosion-Initiating Device with Integrated Safe-and-Arm, EMP-Resistant, and Fast-Acting Technology Based on Photovoltaic Power Converter" . | MICROMACHINES 13 . 5 (2022) . |
| APA | Yin, Guofu , Bao, Huiqin , Zhao, Yulong , Ren, Wei , Ji, Xiangfei , Cheng, Jianhua et al. Design, Fabrication, and Characterization of a Laser-Controlled Explosion-Initiating Device with Integrated Safe-and-Arm, EMP-Resistant, and Fast-Acting Technology Based on Photovoltaic Power Converter . | MICROMACHINES , 2022 , 13 (5) . |
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Abstract ：
This study proposes a highly stable differential resonant accelerometer that is monolithically micro-machined from a piece of ultrapure, single z-cut crystal quartz. The overall structure of quartz accelerometer is centrally symmetrical, which comprises two double-ended tuning forks (DETFs), two link beams, two micro-leverages, a proof mass, and a quartz frame. Micro-leverages and DETFs are perpendicular to each other and are located around the chip, which maximizes the utilization of the sensor area and is conducive to the miniaturization of the sensor. The effectiveness of the structure was verified by theoretical analysis, simulation, and experiment. The structure with differential arrangement can eliminate common mode disturbances, such as temperature, to improve sensitivity to acceleration. Within the measurement range of +/- 100 g, the sensor's sensitivity, which is measured by experiments, is 17.72 Hz/g, with a velocity random walk of 0.84 mu g/root Hz and bias instability of 3.05 mu g, which is consistent with the theoretical analysis results. [2020-0309]
Keyword ：
Acceleration Accelerometers Electrodes High stability Internal stresses resonant accelerometer Sensitivity single crystal quartz Thermal stability Vibrations
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| GB/T 7714 | Han, Chao , Li, Cun , Zhao, Yulong et al. High-Stability Quartz Resonant Accelerometer With Micro-Leverages [J]. | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , 2021 , 30 (2) : 184-192 . |
| MLA | Han, Chao et al. "High-Stability Quartz Resonant Accelerometer With Micro-Leverages" . | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 30 . 2 (2021) : 184-192 . |
| APA | Han, Chao , Li, Cun , Zhao, Yulong , Li, Bo . High-Stability Quartz Resonant Accelerometer With Micro-Leverages . | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS , 2021 , 30 (2) , 184-192 . |
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The paper aims to study the piezoresistive performance and mechanism of amorphous carbon (a-C) film and apply it in the sensitive circuit of micro-electromechanical system (MEMS) pressure sensor. In this paper, the a-C film piezoresistive material was deposited by direct-current (DC) sputtering process. The phase content and the electrical, mechanical and thermal performance of the representative sample were characterized. Then the device was designed by finite element simulation. And the a-C carbon film pressure sensor was successfully fabricated by MEMS processes to carry out test and analysis of device level. The sensitivity of the pressure sensor chip was 9.4 μV/kPa and the non-linearity of output signal was 5.57% FS (full scale) in the range of 0 to1 MPa. The change of the a-C film resistor’s resistance showed linear relation at –70 to 150 . Especially at –20 to 150 , that relation was stronger, which showed that the temperature compensation for the a-C piezoresistive material was easier in high temperature environment. The phase content varied along the thickness-direction of the film, which implied this direction was also needed to be considered in the mechanism research. In conclusion, the a-C carbon film can be well-combined with the traditional MEMS sensor chip in terms of fabrication process, and mechanical and electrical properties. Finally, the a-C piezoresistive pressure sensor also shows satisfactory sensitivity and linearity Furthermore, the thickness-direction of a-C film should be added into the mechanism research. © 2020, Chongqing Wujiu Periodicals Press. All rights reserved.
Keyword ：
Amorphous carbon Carbon films MEMS Pressure sensors
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| GB/T 7714 | Ma, Xin , Zhang, Qi , Guo, Peng et al. MEMS pressure sensor based on piezoresistive effect of amorphous carbon film [J]. | Surface Technology , 2020 , 49 (6) : 60-67 . |
| MLA | Ma, Xin et al. "MEMS pressure sensor based on piezoresistive effect of amorphous carbon film" . | Surface Technology 49 . 6 (2020) : 60-67 . |
| APA | Ma, Xin , Zhang, Qi , Guo, Peng , Tong, Xiao-Shan , Zhao, Yu-Long , Wang, Ai-Ying . MEMS pressure sensor based on piezoresistive effect of amorphous carbon film . | Surface Technology , 2020 , 49 (6) , 60-67 . |
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The rapid growing demand of micro-electromechanical system (MEMS) sensors brings an urgent need for high performance and low cost sensitive materials. In this work, amorphous carbon (a-C) film was in-situ deposited on silicon substrate as strain sensitive component using economical direct current (DC) magnetron sputtering process and the a-C sensor was systematically designed, fabricated and tested. By adjusting the negative bias voltage in the range of 0-400 V, the gauge factor (GF) of the a-C film was adjusted within the range of 3.3-6.9. What's more, the film's sp(2) cluster size played an important role in their piezo-resistive performance and conductivity, which illustrated the thick-film resistors (TFRs) theory. Additionally, CAFM results also supported the applying of TFRs theory in this work. Benefiting from the outstanding performance of a-C film, the MEMS force sensor, consisted a Wheatstone full-bridge with four a-C piezo-resistors, had a sensitivity of 9.8 mu V/V/mN and non-linearity about 2.0% FS in the testing range of 0-210 mN, while it also showed a good repeatability. These investigations provided deeper insight into the piezo-resistive behavior of a-C film and contributed to the development of high performance and more economical sensitive materials for MEMS sensors. (C) 2019 Elsevier B.V. All rights reserved.
Keyword ：
Amorphous carbon film Force sensor Gauge factor MEMS Piezo-resistive effect
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| GB/T 7714 | Ma, Xin , Tong, Xiaoshan , Guo, Peng et al. MEMS piezo-resistive force sensor based on DC sputtering deposited amorphous carbon films [J]. | SENSORS AND ACTUATORS A-PHYSICAL , 2020 , 303 . |
| MLA | Ma, Xin et al. "MEMS piezo-resistive force sensor based on DC sputtering deposited amorphous carbon films" . | SENSORS AND ACTUATORS A-PHYSICAL 303 (2020) . |
| APA | Ma, Xin , Tong, Xiaoshan , Guo, Peng , Zhao, Yulong , Zhang, Qi , Li, Hanchao et al. MEMS piezo-resistive force sensor based on DC sputtering deposited amorphous carbon films . | SENSORS AND ACTUATORS A-PHYSICAL , 2020 , 303 . |
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In this paper, we present a fully printed accelerometer with a piezoresistive carbon paste-based strain gauge printed on its surface, which can be manufactured at low cost and with high efficiency. This accelerometer is composed of two parts: a sensor substrate made from high-temperature resin, which is printed by a 3D printer based on stereolithography apparatus (SLA), and a carbon paste-based strain gauge fabricated by screen-printing technology and by direct ink writing (DIW) technology for the purposes of comparison and optimization. First, the structural design, theoretical analysis, simulation analysis of the accelerometer, and analyses of the conductive mechanism and the piezoresistive mechanism of the carbon paste-based strain gauge were carried out. Then the proposed accelerometer was fabricated by a combination of different printing technologies and the curing conditions of the carbon paste were investigated. After that, the accelerometers with the screen-printed strain gauge and DIW strain gauge were characterized. The results show that the printing precision of the screen-printing process on the sensor substrate is higher than the DIW process, and both accelerometers can perform acceleration measurement. Also, this kind of accelerometer can be used in the field of measuring body motion. All these findings prove that 3D printing technology is a significant method for sensor fabrication and verification. © 2020 by the authors. Licensee MDPI, Basel, Switzerland.
Keyword ：
3D printers Acceleration measurement Accelerometers Carbon Printing presses Screen printing Strain gages Structural design
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| GB/T 7714 | Liu, Mingjie , Zhang, Qi , Zhao, Yulong et al. Design and development of a fully printed accelerometer with a carbon paste-based strain gauge [J]. | Sensors (Switzerland) , 2020 , 20 (12) : 1-17 . |
| MLA | Liu, Mingjie et al. "Design and development of a fully printed accelerometer with a carbon paste-based strain gauge" . | Sensors (Switzerland) 20 . 12 (2020) : 1-17 . |
| APA | Liu, Mingjie , Zhang, Qi , Zhao, Yulong , Shao, Yiwei , Zhang, Dongliang . Design and development of a fully printed accelerometer with a carbon paste-based strain gauge . | Sensors (Switzerland) , 2020 , 20 (12) , 1-17 . |
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Abstract ：
The Safety and Arming Device (SAD) is the essential component that prevents fuze arming until specific conditions have been achieved. The core principle of safety and arming mechanism is the interruption of energy transfer, usually explosion, laser, or high-speed slapper, with a movable interrupter. In the present research, the design and characterization of a MEMS based on-chip SAD are proposed. Comparing with the previous research, the novelty of present work mainly lies in the rotary encryption mechanism of interrupter, which makes the SAD safer and resettable. Furthermore, the SAD is encrypted by the different tooth thickness on the rotary interrupter, which associates with specified decoding voltage. Once the input voltage fails to meet the encryption criteria, the pawl of electrothermal actuator will be captured by the trap in the tooth of interrupter, then the whole system will be locked up. And fabricated on SOI (silicon-on-insulator) wafer with a dimension of 13.4 mm x 9.3 mm x 0.454 mm, it's easy for the on-chip SAD to be integrated in the microfuze or be applied in the information security system for hard-disk encryption. In addition, with the position holding mechanism provided by the double clamped V-shape beam, each single step's movement of interrupter can be accumulated in the rotary direction, which may provide a way to tackle the contradiction between displacement output and force output of MEMS actuator. (C) 2019 Elsevier B.V. All rights reserved.
Keyword ：
Device Electrothermal actuator Encryption system Safety and arming
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| GB/T 7714 | Fang, Kuang , Hu, TengJiang , Jiang, XiaoHua et al. Research on a MEMS based encrypted rotary safety and arming device [J]. | SENSORS AND ACTUATORS A-PHYSICAL , 2020 , 301 . |
| MLA | Fang, Kuang et al. "Research on a MEMS based encrypted rotary safety and arming device" . | SENSORS AND ACTUATORS A-PHYSICAL 301 (2020) . |
| APA | Fang, Kuang , Hu, TengJiang , Jiang, XiaoHua , Zhao, YuLong . Research on a MEMS based encrypted rotary safety and arming device . | SENSORS AND ACTUATORS A-PHYSICAL , 2020 , 301 . |
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Abstract ：
A 3D-printed micro-pressure sensor with high sensitivity is developed in this paper. It is a fully printed pressure sensor fabricated using a combination of digital light processing (DLP)-based printing and screen-printing technologies, with the advantages of high manufacturing efficiency and low cost. The pressure sensor consists of a sensor substrate with a circular diaphragm and a Wheatstone bridge on the surface. First, the pressure sensor was theoretically analyzed and then verified using the finite element method (FEM). During fabrication, the sensor substrate was made from a transparent high-temperature resin, which was printed by a DLP-based 3D printer. The resistors and leads of the Wheatstone bridge were made from carbon paste and silver paste, respectively, and printed by screen-printing technology. Then, the resistors were characterized to find the gauge factor and the print consistency between different resistors. Next, the experimental setup was established for the characterization of the pressure sensor. Three loops of pressurization and depressurization from 0 kPa to 2.4 kPa were applied to the pressure sensor continuously, and the output voltage was recorded. The experimental results show that the gauge factor of the carbon resistor is 17.01 +/- 1.85, the sensitivity of the sensor is 4.5522 mV/kPa/5 V, the linearity error is 2.077% FS, the hysteresis error is 6.327% FS and the repeatability error is 5.708% FS. Also, it is very convenient to obtain pressure sensors with different sensitivities and measurement ranges by changing the thickness of the circular diaphragm. All these results prove that the proposed sensor provides a low cost and high sensitivity approach for micro-pressure measurement, and that 3D printing can be applied to the production of personalized sensors.
Keyword ：
3D printing digital light processing micro-pressure sensor screen printing
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| GB/T 7714 | Liu, Mingjie , Zhang, Qi , Zhao, Yulong et al. A high sensitivity micro-pressure sensor based on 3D printing and screen-printing technologies [J]. | MEASUREMENT SCIENCE AND TECHNOLOGY , 2020 , 31 (3) . |
| MLA | Liu, Mingjie et al. "A high sensitivity micro-pressure sensor based on 3D printing and screen-printing technologies" . | MEASUREMENT SCIENCE AND TECHNOLOGY 31 . 3 (2020) . |
| APA | Liu, Mingjie , Zhang, Qi , Zhao, Yulong , Liu, Chuanqi , Shao, Yiwei , Tong, Xiaoshan . A high sensitivity micro-pressure sensor based on 3D printing and screen-printing technologies . | MEASUREMENT SCIENCE AND TECHNOLOGY , 2020 , 31 (3) . |
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Abstract ：
Future piezo-(ferro-)electric devices, in particularly the transducers with the miniaturized size require materials with thickness in micrometer scale, which limit the utilization of bulk materials due to the difficulty of thinning. Modified composite sol-gel methods turns out to be a powerful approach to fabricate thick piezo-(ferro-)electric oxide films with thicknesses of several micrometers, which satisfy the requirements of devices particularly transducers. We report the preparation of the lead-free (Bi0·5Na0.5)1-xBaxTiO3-Bi0.5Na0·5TiO3 (BNBTx%-BNT, x = 0, 0.05, 0.06, 0.07) 0–3 composite ferroelectric thick films using a modified composite sol-gel technique. The impacts of the composition of the powders and the thickness of films on the structural and electrical properties of BNBTx%-BNT composite thick films have been in-depth investigated. The dielectric, ferroelectric and piezoelectric properties of the films strongly depend on the composition of the ferroelectric powders. The most excellent electrical properties are found in BNBT6-BNT films, which have the phase at morphotropic phase boundary. These results indicate that the BNBTx%-BNT 0–3 composite thick films are a highly promising lead-free piezoelectric material for piezo-(ferro-)electric device applications like high-frequency transducers. © 2020 Elsevier B.V.
Keyword ：
Bismuth compounds Composite films Ferroelectric films Ferroelectricity Ferroelectric materials Film preparation Micrometers Oxide films Piezoelectricity Powders Sodium compounds Sol-gel process Sol-gels Thick films Thickness measurement Transducers
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| GB/T 7714 | Zhao, Jinyan , Niu, Gang , Ren, Wei et al. Structural and electrical properties of sodium bismuth titanate based 0–3 composite lead-free ferroelectric thick films [J]. | Journal of Alloys and Compounds , 2020 , 829 . |
| MLA | Zhao, Jinyan et al. "Structural and electrical properties of sodium bismuth titanate based 0–3 composite lead-free ferroelectric thick films" . | Journal of Alloys and Compounds 829 (2020) . |
| APA | Zhao, Jinyan , Niu, Gang , Ren, Wei , Wang, Lingyan , Zhang, Nan , Shi, Peng et al. Structural and electrical properties of sodium bismuth titanate based 0–3 composite lead-free ferroelectric thick films . | Journal of Alloys and Compounds , 2020 , 829 . |
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Abstract ：
Pressure sensors that can work over 500 are widely needed in aerospace and petrochemical fields, while silicon based high temperature pressure sensors are difficult to survive such high temperature. Silicon carbide (SiC) shows better mechanical and electrical properties than silicon, which is a feasible candidate to replace silicon for manufacturing high temperature pressure sensor that can work over 500 . However, because of the ultra-high hardness and excellent chemical inertness of SiC, it is difficult to pattern structures on SiC wafer by common etching methods, especially deep etching. Femtosecond laser (fs-laser) is a practicable tool for SiC micromachining as reported in many literatures, but few of them concerns on SiC deep etching in fabricating high temperature pressure sensor's sensitive diaphragm. In this paper, blind holes with diameter of 1200 μm and depth of 270 μm were fabricated on a 350 μm-thick 4H-SiC wafer by fs-laser, which forms an 80 μm-thick membrane as sensitive diaphragm for pressure sensor. Experiments were conducted to study shape deviation, machining accuracy, edge morphology, sidewall steepness as well as surface roughness of the machined structure. Testing results show that the size errors of machined blind holes are 2.02 % in diameter and 0.38 % in depth, the sidewall steepness is good with an inclination angle of 1.7°, and surface of the sensitive diaphragm is smooth with an average roughness of 320 nm. However, elliptical shape and over etching happens to the fabricated sensitive diaphragm because of inappropriate laser scanning mode, uneven energy distribution and laser irradiation delay. Generally, research shows that fs-laser micromachining is a feasible method for SiC deep etching in fabricating sensitive diaphragm of high temperature pressure sensor. © 2020 The Authors
Keyword ：
Etching Fabrication Femtosecond lasers Micromachining Morphology Partial pressure sensors Pressure sensors Silicon carbide Silicon wafers Surface roughness
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| GB/T 7714 | Zhao, You , Zhao, Yu-Long , Wang, Lu-Kang . Application of femtosecond laser micromachining in silicon carbide deep etching for fabricating sensitive diaphragm of high temperature pressure sensor [J]. | Sensors and Actuators, A: Physical , 2020 , 309 . |
| MLA | Zhao, You et al. "Application of femtosecond laser micromachining in silicon carbide deep etching for fabricating sensitive diaphragm of high temperature pressure sensor" . | Sensors and Actuators, A: Physical 309 (2020) . |
| APA | Zhao, You , Zhao, Yu-Long , Wang, Lu-Kang . Application of femtosecond laser micromachining in silicon carbide deep etching for fabricating sensitive diaphragm of high temperature pressure sensor . | Sensors and Actuators, A: Physical , 2020 , 309 . |
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An eccentric reflective optical fiber micro-electro-mechanical system (MEMS) micro-pressure sensor is proposed in this paper. The core part of the sensor consists of a dual fiber collimator (a fiber collimator with two pigtails) in an eccentric position and a sensitive silicon diaphragm. The sensitive silicon diaphragm adopts the BM (beam-membrane) structure with small structural parameters manufactured by MEMS manufacturing technology. Simulation results show that the BM structure has good sensitivity and high natural frequency. Overall structure of the sensor with the measurement range of 0 ∼ 10 kPa is designed. The way of intensity demodulation ensures the performance and stability of the sensor and makes the sensing system easier to process signals. By building a static test platform and conducting experiments, we can conclude that the sensitivity of the sensor is-0.32 dB kPa-1. Furthermore, the repeatability of the sensor is 1.26%FS (full-scale), the hysteresis of the sensor is 0.95%FS and the zero drift of the sensor is 0.615%FS h-1. By building a dynamic experimental platform and conducting experiments, it can be seen that the response time of the sensor is 0.47 ms ( © 2020 IOP Publishing Ltd.
Keyword ：
MEMS Microsensors Optical collimators Optical fibers Pressure sensors
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| GB/T 7714 | Tian, Bian , Li, Kaikai , Liu, Jiangjiang et al. Eccentric reflective optical fiber MEMS micro-pressure sensor [J]. | Journal of Micromechanics and Microengineering , 2020 , 30 (8) . |
| MLA | Tian, Bian et al. "Eccentric reflective optical fiber MEMS micro-pressure sensor" . | Journal of Micromechanics and Microengineering 30 . 8 (2020) . |
| APA | Tian, Bian , Li, Kaikai , Liu, Jiangjiang , Zhao, Na , Lin, Qijing , Zhao, Yulong et al. Eccentric reflective optical fiber MEMS micro-pressure sensor . | Journal of Micromechanics and Microengineering , 2020 , 30 (8) . |
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