Republication

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Republication Author Republication date Publisher
GB/T 22181-24-2016 等离子体显示器件 第2-4部分 数字电视机用器件特性测量方法 邓新群，胡文波，王平松，赵晓东，王丽雯，黄长戈，唐礼，黄卫东 2016-11-01 中国标准出版社
GB/T 22181-6-2015 等离子体显示器件 第6部分: 数字电视机用等离子体显示器件空白详细规范 邓新群，胡文波，王平松，赵晓东，王丽雯，黄长戈，唐礼 2016-11-01 中国标准出版社
GB/T 22181.5-2015 等离子体显示器件 第5部分：总规范 邓新群，胡文波，王平松，赵晓东，王丽雯，黄长戈，唐礼 2015-06-02 中国标准出版社
SJ/T 11378-61-2015 等离子体显示器件 第6-1部分：数字电视机用彩色等离子体显示器件详细规范 王平松、胡文波、唐礼、邓新群、蒋孝荣、宋国武、王文东、高宏伟、邢晓玲 2015-04-01 中国标准出版社
SJ/T 11378.7-2015 等离子体显示器件 第7部分：数字电视机用等离子体显示器件可靠性试验方法 王平松、胡文波、唐礼、邓新群、蒋孝荣、宋国武、王文东、高宏伟、邢晓玲 2015-04-01 中国标准出版社
GB/T 22181.1-2008 等离子体显示器件 第1部分：术语与文字符号 胡文波，刘纯亮，王幼林 2008-09-01 中国标准出版社
平板显示技术 应根裕，胡文波，邱勇 等 2002-11-01 人民邮电出版社
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Paper

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Paper Name Author Publication/Completion Time Magazine Name
Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang 2024-03-25 Diamond and Realted Materials
Thermal effect of Nd:YAG bonded on diamond by Mo/Au metal intermediate layer at room temperature NK Deng, YF Qu, J Yuan, WB Hu*, ZY Zhang, HX Wang 2024-01-09 Optical Materials
Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang 2024-01-07 Journal of Materials Engieering and Performance
3D structure of box-and-grid electron multiplier with higher electron collection efficiency ZC Xia, YR Wang, YW Peng, J Li, WB Hu, X Zhong, SL Wu 2024-01-01 Journal of Vacuum Science and Technology B
Secondary electron emission enhancement of MgO-Au composite film by SiO2 doping in MgO surface layer L Liu, J Li, KJ Ma, BY Liu, YZ Xue, WB Hu*, SL Wu, HQ Fan 2023-11-28 Materials Letters
Heat transfer properties of single crystal diamond zigzag double-layer microchannel heat sinks L Du, J Yuan, NK Deng, YF Qu, XF Zhang, WB Hu* 2023-11-26 International Journal of Thermal Sciences
Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang 2023-11-06 Diamond and Related Materials
Effect of diamond cap thickness on temperature distribution and thermal aberration of thin disk Nd:YAG laser crystal NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, ZY Zhang, HX Wang 2023-08-31 Diamond and Related Materials
Effect of the thickness of amorphous silicon intermediate layer on the thermal transport of silicon/diamond interface YF Qu, J Yuan, NK Deng, WB Hu*, SL Wu, HX Wang 2023-08-31 Results in Physics
An overview of heat transfer enhancement methods in microchannel heat sinks L Du, WB Hu* 2023-08-18 Chemical Engineering Science
Investigation on the thermal aberration of Nd:YAG on SiC fabricated by room temperature bonding with a Mo/Au nano-interlayer NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, ZY Zhang, SL Wu, HX Wang 2023-08-10 Optical Materials Express
Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers YF Qu, HY Bai, WB Hu*, Y Yuan, SL Wu, HX Wang, HQ Fan 2023-05-28 Surface Topography-Metrology and Properties
Room temperature bonding of diamond/Si with Mo/Au interlayers in atmospheric air F Wang, K Wang, GQ Chen, F Lin, RZ Wang, W Wang, MH Zhang, WB Hu*, HX Wang* 2023-04-15 Diamond and Related Materials
High-threshold-voltage and low-leakage-current of normally-off H-diamond FET with self-aligned Zr/ZrO2 gate F Wang, GQ Chen, W Wang, MH Zhang, S He, GQ Shao, YF Wang, WB Hu, HX Wang* 2023-03-20 Diamond and Related Materials
Enhanced thermal stability of Ga2O3 MOSFETs with nanocrystalline diamond field plate YF Qu, BQ Ren, J Yuan, NK Deng, WB Hu*, HX Liu, Y Yuan, SL Wu,HX Wang 2023-03-08 Diamond and Related Materials
Electron-induced secondary electron emission of aluminum alloy processed via the combination of alodine treatment and carbon film deposition J Li, BY Liu, SL Wu, YD Li,WB Hu* 2023-02-12 Materials Letters
Effect of the Surface Morphology of Porous Coatings on Secondary Electron Yield of Metal Surface M Peng, S Lin, CX Zhang, HF Liang, CL Liu, M Cao,WB Hu, YG Zhai, YD Li 2022-07-03 Materials
Highly transparent oxide-based ultraviolet photodetectors for flexible electronics YJ Li, HL Ma, WB Hu, YQ Zhao 2022-06-22 Journal of Materials Science-Materials in Electronics
Electrical and Thermal Characteristics of AlGaN/GaN HEMT Devices with Dual Metal Gate Structure: A Theoretical Investigation YF Qu,NK Deng, Y Yuan, WB Hu*, HX Liu, SL Wu, HX Wang 2022-06-18 Materials
Argon Ion Beam Current Dependence of Si-Si Surface Activated Bonding S Yang, NK Deng, YF Qu, K Wang, Y Yuan, WB Hu*, SL Wu, HX Wang 2022-05-20 Materials
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Patent

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Patent Name Application Number xjtu.gr.patent.type Application Date
一种金刚石基氮化镓复合晶片及其键合制备方法 2020105866928 Invention 2020.07.01
一种降低铝基材料二次电子发射系数的表面处理方法 202010214903.5 Invention 2020.03.24
一种用于电子倍增器快速精确装配的工装及装配方法 2019110633056 Invention 2019.10.31
一种表面活化过程中高速氩原子束获得装置及获得方法 2019108126547 Invention 2019.08.30
一种用于抑制二次电子发射的碳基薄膜及其制备方法 2019106220050 Invention 2019.07.10
一种金刚石输能窗及其制备方法 2019105449861 Invention 2019.06.21
一种金刚石基氮化镓高电子迁移率晶体管异质集成方法 2019102225727 Invention 2019.03.22
一种电子倍增器的结构及组装方法 2018110459572 Invention 2018.09.07
用于氮化镓和金刚石直接键合的生产设备 201821062676.3 Utility model 2018.08.01
一种氮化镓/金刚石的直接键合方法 201810732475.8 Invention 2018.08.01
金属与氧化锌掺杂氧化镁二次电子发射薄膜及其制备方法 2018101835124 Invention 2018.03.06
一种氧化镁金属陶瓷二次电子发射薄膜及其制备方法 2017112404156 Invention 2017.11.30
掺杂金属和氧化铝的氧化镁二次电子发射薄膜及其制备方法 2017109428600 Invention 2017.10.11
一种二次电子发射薄膜的缓冲层及其制备方法 2016110973425 Invention 2016.12.02
打拿极结构及基于该打拿极结构的弧形打拿极电子倍增器 2015108086274 Invention 2015.11.19
一种打拿极薄膜结构及基于打拿极薄膜结构的电子倍增器 2015108086289 Invention 2015.11.19
一种多层表面传导电子发射源结构及其制备方法 2015108084368 Invention 2015.11.19
一种用于二次电子发射的金刚石薄膜的制备方法 2015102559804 Invention 2015.05.19
一种表面传导电子发射源结构及其制作方法 201510036036X Invention 2015.01.23
一种动态多级串联同轴碟型通道打拿级电子倍增器 2014106416701 Invention 2014.11.13
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